cystech electronics corp. spec. no. : c817i3-h issued date : 2003.04.02 revised date: 2009.02.04 page:1/5 BTB772I3 cystek product specification low vcesat pnp epitaxial planar transistor bv ceo -30v i c -3a r cesat 150m BTB772I3 features ? low v ce (sat),typically -0.3 v at i c / i b = -2a / -0.2a ? excellent current gain characteristics ? complementary to btd882i3 ? rohs compliant package symbol outline BTB772I3 to-251 b c e b base c collector e emitter absolute maximum ratings (ta=25 c) parameter symbol limit unit collector-base voltage v cbo -40 v collector-emitter voltage v ceo -30 v emitter-base voltage v ebo -5 v i c (dc) -3 a collector current i c (pulse) -7 *1 a pd(ta=25 ) 1 power dissipation pd(tc=25 ) 10 w junction temperature tj 150 c storage temperature tstg -55~+150 c note : *1. single pulse pw 350 s,du Q ty 2% Q .
cystech electronics corp. spec. no. : c817i3-h issued date : 2003.04.02 revised date: 2009.02.04 page:2/5 BTB772I3 cystek product specification characteristics (ta=25 c) symbol min. typ. max. unit test conditions bv cbo -40 - - v i c =-50 a, i e =0 bv ceo -30 - - v i c =-1ma, i b =0 bv ebo -5 - - v i e =-50 a, i c =0 i cbo - - -1 a v cb =-30v, i e =0 i ebo - - -1 a v eb =-3v, i c =0 *v ce(sat) - -0.3 -0.5 v i c =-2a, i b =-0.2a *v be(sat) - -1 -2 v i c =-2a, i b =-0.2a *h fe 1 120 - - - v ce =-2v, i c =-20ma *h fe 2 180 - 500 - v ce =-2v, i c =-1a f t - 80 - mhz v ce =-5v, i e =-0.1a, f=100mhz cob - 55 - pf v cb =-10v, f=1mhz *pulse test : pulse width 380 s, duty cycle 2% classification of h fe 2 rank p e range 180~390 250~500 ordering information device package shipping marking BTB772I3 to-251 (rohs compliant) 80 pcs / tube, 50 tubes / box b772
cystech electronics corp. spec. no. : c817i3-h issued date : 2003.04.02 revised date: 2009.02.04 page:3/5 BTB772I3 cystek product specification characteristic curves current gain vs collector current 10 100 1000 1 10 100 1000 10000 collector current---ic(ma) current gain---hf e vce=5v vce=2 v vce=1v c-e saturation voltage vs collector current 1 10 100 1000 10000 1 10 100 1000 10000 collector current---ic(ma) c-e saturation voltage---vce(sat)(mv ) ic=40ib ic=20ib ic=10ib b-e saturation voltage vs collector current 100 1000 10000 1 10 100 1000 10000 collector current---ic(ma) b-e saturation---vbe(sat)(mv) ic=10ib power derating curves 0 2 4 6 8 10 12 0 50 100 150 200 temperature---() power dissipation---(w) ta=25 tc=25 recommended storage condition: temperature : 10~ 35 c humidity : 30~ 60% rh
cystech electronics corp. spec. no. : c817i3-h issued date : 2003.04.02 revised date: 2009.02.04 page:4/5 BTB772I3 cystek product specification recommended wave soldering condition soldering time product peak temperature pb-free devices 260 +0/-5 c 5 +1/-1 seconds recommended temperature profile for ir reflow profile feature sn-pb eutectic assembly pb-free assembly average ramp-up rate (tsmax to tp) 3 c/second max. 3 c/second max. preheat ? temperature min(t s min) ? temperature max(t s max) ? time(ts min to ts max ) 100 c 150 c 60-120 seconds 150 c 200 c 60-180 seconds time maintained above: ? temperature (t l ) ? time (t l ) 183 c 60-150 seconds 217 c 60-150 seconds peak temperature(t p ) 240 +0/-5 c 260 +0/-5 c time within 5 c of actual peak temperature(tp) 10-30 seconds 20-40 seconds ramp down rate 6 c/second max. 6 c/second max. time 25 c to peak temperature 6 minutes max. 8 minutes max. note : all temperatures refer to topside of t he package, measured on the package body surface.
cystech electronics corp. spec. no. : c817i3-h issued date : 2003.04.02 revised date: 2009.02.04 page:5/5 BTB772I3 cystek product specification to-251 dimension *: typical inches millimeters a e f g h j i 3 2 1 k c d b style: pin 1.base 2.collector 3.emitter 3-lead to-251 plastic package cystek packa g e code: i3 marking: b772 device name hfe rank date code inches millimeters dim min. max. min. max. dim min. max. min. max. a 0.0177 0.0217 0.45 0.55 g 0.2559 - 6.50 - b 0.0354 0.0591 0.90 1.50 h - *0.1811 - *4.60 c 0.0177 0.0236 0.45 0.60 i - 0.0449 - 1.14 d 0.0866 0.0945 2.20 2.40 j - 0.0346 - 0.88 e 0.2441 0.2677 6.20 6.80 k 0.2047 0.2165 5.20 5.50 f 0.2677 0.2835 6.80 7.20 notes: 1.controlling dimension: millimeters. 2.maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.if there is any question with packing specification or packing method, please c ontact your local cystek sales office. material: ? lead: kfc; pure tin plated ? mold compound: epoxy resin family, flammability solid burning class: ul94v-0 important notice: ? all rights are reserved. reproduction in whole or in part is prohibited without the prior written approval of cystek. ? cystek reserves the right to make changes to its products without notice. ? cystek semiconductor products are not warranted to be suitable for use in life-support applications, or systems. ? cystek assumes no liability for any consequence of customer pr oduct design, infringement of pat ents, or application assistance .
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